Main applications of tungsten copper alloy

Tungsten-copper alloy combines the advantages of metal tungsten and copper. Among them, tungsten has a high melting point (the melting point of tungsten is 3410°C and the melting point of copper is 1080°C) and high density (the density of tungsten is 19.34g/cm3 and the density of copper is 8.89 g/cm3) ; Copper has electrical and thermal conductivity. Tungsten-copper alloy (generally composed in the range of WCu7~WCu50) has a uniform microstructure, high temperature resistance, high strength, arc ablation resistance, and high density; it has moderate electrical and thermal conductivity and is widely used in military high-temperature resistant materials. , electrical alloys for high-voltage switches, electrical machining electrodes, and microelectronic materials, as parts and components, are widely used in aerospace, aviation, electronics, electric power, metallurgy, machinery, sports equipment and other industries. Tungsten-copper alloys are used in aerospace as nozzles, gas rudders, air rudders, and nose cones for missiles and rocket engines. The main requirements are high temperature resistance (3000K~5000K) and high-temperature airflow resistance. Copper is mainly used under high temperatures. The refrigeration effect of sweating caused by volatilization (the melting point of copper is 1083°C) reduces the surface temperature of tungsten copper, ensuring its use under badness conditions of high temperature. Tungsten copper alloy is widely used in high-voltage switches, 128kV SF6 circuit breakers WCu/CuCr, and high-voltage vacuum load switches (12kV 40.5KV 1000A) and arresters. High-voltage vacuum switches are small in size, easy to maintain, have a wide range of use, and can be used in wet, Used in flammable, explosive and corrosive environments. The main performance requirements are resistance to arc ablation, resistance to fusion welding, small cut-off current, low gas content, and low thermal electron emission capability. In addition to conventional macroscopic performance requirements, porosity and microstructural properties are also required, so special processes must be adopted, including complex processes such as vacuum degassing and vacuum infiltration.